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| DATA SHEET GaAs INTEGRATED CIRCUIT PG2214TB L, S-BAND SPDT SWITCH DESCRIPTION The PG2214TB is a GaAs MMIC for L, S-band SPDT (Single Pole Double Throw) switch which was developed for mobile phone and another L, S-band application. This device can operate 2 control switching by control voltage 1.8 to 5.3 V. This device can operate frequency from 0.05 to 3.0 GHz, having the low insertion loss and high isolation. This device is housed in a 6-pin super minimold package. And this package is able to high-density surface mounting. FEATURES * Switch control voltage * : Vcont (H) = 1.8 to 5.3 V (3.0 V TYP.) : Vcont (L) = -0.2 to +0.2 V (0 V TYP.) Low insertion loss : Lins1 = 0.25 dB TYP. @ f = 0.05 to 0.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Lins2 = 0.25 dB TYP. @ f = 0.5 to 1.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Lins3 = 0.30 dB TYP. @ f = 1.0 to 2.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Lins4 = 0.35 dB TYP. @ f = 2.0 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Lins5 = 0.35 dB TYP. @ f = 2.5 to 3.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V High isolation : ISL1 = 32 dB TYP. @ f = 0.05 to 0.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : ISL2 = 28 dB TYP. @ f = 0.5 to 1.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : ISL3 = 27 dB TYP. @ f = 1.0 to 2.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : ISL4 = 26 dB TYP. @ f = 2.0 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : ISL5 = 24 dB TYP. @ f = 2.5 to 3.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V Handling power : Pin (1 dB) = +27.0 dBm TYP. @ f = 0.5 to 3.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Pin (1 dB) = +20.0 dBm TYP. @ f = 0.5 to 3.0 GHz, Vcont (H) = 1.8 V, Vcont (L) = 0 V High-density surface mounting : 6-pin super minimold package (2.0 x 1.25 x 0.9 mm) * * * APPLICATIONS * L, S-band digital cellular or cordless telephone TM * W-LAN, WLL and Bluetooth etc. ORDERING INFORMATION Part Number Package 6-pin super minimold (2012) Marking G4J Supplying Form * Embossed tape 8 mm wide * Pin 4, 5, 6 face the perforation side of the tape * Qty 3 kpcs/reel PG2214TB-E4 Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PG2214TB Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. Document No. PG10477EJ03V0DS (3rd edition) Date Published October 2004 CP(K) Printed in Japan The mark shows major revised points. NEC Compound Semiconductor Devices, Ltd. 2004 PG2214TB PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) 1 61 (Top View) 66 (Bottom View) 1 Pin No. 1 2 3 4 Pin Name OUTPUT1 GND OUTPUT2 Vcont2 INPUT Vcont1 G4J Vcont1 Low High Low Parameter Parameter 2 52 55 2 3 43 44 3 5 6 TRUTH TABLE Vcont2 High INPUT-OUTPUT1 ON OFF INPUT-OUTPUT2 OFF ON ABSOLUTE MAXIMUM RATINGS (TA = +25C, unless otherwise specified) Symbol Vcont Pin TA Tstg Ratings +6.0 Note Unit V dBm C C Switch Control Voltage Input Power Operating Ambient Temperature Storage Temperature +30 -45 to +85 -55 to +150 Note Vcont1 - Vcont2 6.0 V RECOMMENDED OPERATING RANGE (TA = +25C, unless otherwise specified) Symbol Vcont (H) Vcont (L) MIN. 1.8 -0.2 TYP. 3.0 0 MAX. 5.3 0.2 Unit V V Switch Control Voltage (H) Switch Control Voltage (L) 2 Data Sheet PG10477EJ03V0DS PG2214TB ELECTRICAL CHARACTERISTICS (TA = +25C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, DC cut capacitors = 100 pF, unless otherwise specified) Parameter Insertion Loss 1 Insertion Loss 2 Insertion Loss 3 Insertion Loss 4 Insertion Loss 5 Isolation 1 Isolation 2 Isolation 3 Isolation 4 Isolation 5 Input Return Loss 1 Input Return Loss 2 Output Return Loss 1 Output Return Loss 2 0.1 dB Loss Compression Input Power Note 2 Symbol Lins1 Lins2 Lins3 Lins4 Lins5 ISL1 ISL2 ISL3 ISL4 ISL5 RLin1 RLin2 RLout1 RLout2 Pin (0.1 dB) Test Conditions f = 0.05 to 0.5 GHz f = 0.5 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.0 to 2.5 GHz f = 2.5 to 3.0 GHz f = 0.05 to 0.5 GHz f = 0.5 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.0 to 2.5 GHz f = 2.5 to 3.0 GHz f = 0.05 to 0.5 GHz f = 0.5 to 3.0 GHz f = 0.05 to 0.5 GHz f = 0.5 to 3.0 GHz f = 2.0/2.5 GHz f = 0.5 to 3.0 GHz Note 1 Note 1 Note 1 Note 1 MIN. - - - - - 29 25 24 23 21 15 15 15 15 +21.0 - - - - - - - - TYP. 0.25 0.25 0.30 0.35 0.35 32 28 27 26 24 20 20 20 20 +23.0 +23.0 +27.0 -55 -55 -55 -55 +58 MAX. 0.45 0.45 0.50 0.55 0.60 - - - - - - - - - - - - -47 -47 -47 -47 - Unit dB dB dB dB dB dB dB dB dB dB dB dB dB dB dBm dBm dBm 1 dB Loss Compression Input Power Note 3 Pin (1 dB) f = 0.5 to 3.0 GHz 2nd Harmonics 2f0 f = 2.0 GHz, Pin = +15 dBm f = 2.5 GHz, Pin = +15 dBm dBc dBc dBc dBc dBm 3rd Harmonics 3f0 f = 2.0 GHz, Pin = +15 dBm f = 2.5 GHz, Pin = +15 dBm Intermodulation Intercept Point IIP3 f = 0.5 to 3.0 GHz, 2 tone, Pin = +16 dBm, 5 MHz spicing Switch Control Current Switch Control Speed Icont tSW 50% CTL to 90/10% RF 4 20 20 200 A ns - Notes 1. DC cut capacitors = 1 000 pF at f = 0.05 to 0.5 GHz 2. Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear range. 3. Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear range. Data Sheet PG10477EJ03V0DS 3 PG2214TB ELECTRICAL CHARACTERISTICS (TA = +25C, Vcont (H) = 1.8 V, Vcont (L) = 0 V, DC cut capacitors = 100 pF, unless otherwise specified) Parameter Insertion Loss 6 Insertion Loss 7 Insertion Loss 8 Insertion Loss 9 Insertion Loss 10 Isolation 6 Isolation 7 Isolation 8 Isolation 9 Input Return Loss 3 Output Return Loss 3 0.1 dB Loss Compression Input Power Note 2 Symbol Lins6 Lins7 Lins8 Lins9 Lins10 ISL6 ISL7 ISL8 ISL9 RLin3 RLout3 Pin (0.1 dB) Test Conditions f = 0.05 to 0.5 GHz f = 0.5 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.0 to 2.5 GHz f = 2.5 to 3.0 GHz f = 0.05 to 0.5 GHz f = 0.5 to 2.0 GHz f = 2.0 to 2.5 GHz f = 2.5 to 3.0 GHz f = 0.05 to 3.0 GHz f = 0.05 to 3.0 GHz f = 2.0/2.5 GHz f = 0.5 to 3.0 GHz Note 1 Note 1 Note 1 MIN. - - - - - 27 23 21 20 15 15 +14.0 - - - TYP. 0.25 0.25 0.30 0.35 0.35 30 27 25 24 20 20 +17.0 +17.0 +20.0 MAX. 0.50 0.50 0.55 0.60 0.65 - - - - - - - - - Unit dB dB dB dB dB dB dB dB dB dB dB dBm dBm dBm Note 1 1 dB Loss Compression Input Power Note 3 Pin (1 dB) f = 0.5 to 3.0 GHz Switch Control Current Switch Control Speed Icont tSW 50% CTL to 90/10% RF 4 20 20 200 A ns - Notes 1. DC cut capacitors = 1 000 pF at f = 0.05 to 0.5 GHz 2. Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear range. 3. Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear range. Caution This device is used it is necessary to use DC cut capacitors. The value of DC cut capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. The range of recommended DC cut capacitor value is less than 100 pF. 4 Data Sheet PG10477EJ03V0DS PG2214TB EVALUATION CIRCUIT OUTPUT2 OUTPUT1 C0 C0 Note 3 2 1 4 5 6 C0 1 000 pF 1 000 pF Vcont2 INPUT Vcont1 Note C0 : 0.05 to 0.5 GHz 1 000 pF : 0.5 to 3.0 GHz 100 pF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. Data Sheet PG10477EJ03V0DS 5 PG2214TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD Vcont2 6pin SMM SPDT SW Vc2 OUTPUT2 OUT 2 C2 C 2 C 4 C1 INPUT C1 IN C 5 C3 G4J C1 C 1 C2 OUT 1 OUTPUT1 Vc1 Vcont1 USING THE NEC EVALUATION BOARD Symbol C1, C2, C3 C4, C5 Values 100 pF 1 000 pF 6 Data Sheet PG10477EJ03V0DS PG2214TB TYPICAL CHARACTERISTICS (TA = +25C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, DC cut capacitors = 100 pF, unless otherwise specified) INPUT-OUTPUT1 INSERTION LOSS vs. FREQUENCY 5 4 1: -0.533 dB 1.0 GHz 2: -0.674 dB 1.5 GHz 3: -0.830 dB 2.0 GHz 4: -0.939 dB 2.5 GHz 5: -1.142 dB 3.0 GHz INPUT-OUTPUT2 INSERTION LOSS vs. FREQUENCY 5 4 1: -0.533 dB 1.0 GHz 2: -0.688 dB 1.5 GHz 3: -0.860 dB 2.0 GHz 4: -0.949 dB 2.5 GHz 5: -1.152 dB 3.0 GHz Insertion Loss Lins (dB) 2 1 0 -1 -2 -3 -4 -5 0.5 1.0 1.5 2.0 2.5 1 2 3 Insertion Loss Lins (dB) 3 3 2 1 0 -1 -2 -3 -4 1 2 3 4 5 4 5 3.0 3.5 -5 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Frequency f (GHz) Frequency f (GHz) Remark The graphs indicate nominal characteristics. Caution These characteristics values include the losses of the NEC evaluation board. Data Sheet PG10477EJ03V0DS 7 PG2214TB INPUT-OUTPUT1 ISOLATION vs. FREQUENCY 50 40 30 Isolation ISL (dB) 1: -29.439 dB 1.0 GHz 2: -29.405 dB 1.5 GHz 3: -31.854 dB 2.0 GHz 4: -36.656 dB 2.5 GHz 5: -35.398 dB 3.0 GHz INPUT-OUTPUT2 ISOLATION vs. FREQUENCY 50 40 30 Isolation ISL (dB) 1: -29.393 dB 1.0 GHz 2: -29.243 dB 1.5 GHz 3: -31.255 dB 2.0 GHz 4: -34.569 dB 2.5 GHz 5: -34.949 dB 3.0 GHz 20 10 0 -10 -20 -30 -40 -50 0.5 1.0 2 1.5 3 2.0 4 2.5 1 20 10 0 -10 -20 -30 1 2 1.0 1.5 3 2.0 5 3.0 3.5 -40 -50 0.5 4 2.5 5 3.0 3.5 Frequency f (GHz) Frequency f (GHz) INPUT-OUTPUT1 INPUT RETURN LOSS vs. FREQUENCY 50 40 Input Return Loss RLin (dB) 1: -28.279 dB 1.0 GHz 2: -22.334 dB 1.5 GHz 3: -19.341 dB 2.0 GHz 4: -19.843 dB 2.5 GHz 5: -24.355 dB 3.0 GHz INPUT-OUTPUT2 INPUT RETURN LOSS vs. FREQUENCY 50 40 Input Return Loss RLin (dB) 1: -29.277 dB 1.0 GHz 2: -22.261 dB 1.5 GHz 3: -19.021 dB 2.0 GHz 4: -19.468 dB 2.5 GHz 5: -24.914 dB 3.0 GHz 30 20 10 0 -10 -20 -30 -40 -50 0.5 1.0 1.5 2.0 2.5 1 2 3 4 30 20 10 0 -10 -20 -30 -40 1 2 3 4 5 5 3.0 3.5 -50 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Frequency f (GHz) Frequency f (GHz) INPUT-OUTPUT1 OUTPUT RETURN LOSS vs. FREQUENCY 50 Output Return Loss RLout (dB) INPUT-OUTPUT2 OUTPUT RETURN LOSS vs. FREQUENCY 50 Output Return Loss RLout (dB) 40 30 20 10 0 -10 -20 -30 -40 -50 0.5 1.0 1.5 2.0 2.5 1 2 3 4 1: -30.808 dB 1.0 GHz 2: -22.826 dB 1.5 GHz 3: -19.596 dB 2.0 GHz 4: -19.41 dB 2.5 GHz 5: -22.554 dB 3.0 GHz 40 30 20 10 0 -10 -20 -30 -40 -50 0.5 1.0 1.5 2.0 2.5 1 2 3 4 1: -29.853 dB 1.0 GHz 2: -22.191 dB 1.5 GHz 3: -18.863 dB 2.0 GHz 4: -18.563 dB 2.5 GHz 5: -23.874 dB 3.0 GHz 5 5 3.0 3.5 3.0 3.5 Frequency f (GHz) Frequency f (GHz) Remark The graphs indicate nominal characteristics. 8 Data Sheet PG10477EJ03V0DS PG2214TB OUTPUT POWER vs. INPUT POWER 30 f = 2 GHz Output Power Pout (dBm) 25 20 15 10 5 10 12 14 16 18 20 22 24 26 28 30 Input Power Pin (dBm) Remark The graph indicate nominal characteristics. Data Sheet PG10477EJ03V0DS 9 PG2214TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.10.1 1.250.1 2.00.2 1.3 0.65 0.65 0.1 MIN. 0.90.1 0.7 10 Data Sheet PG10477EJ03V0DS 0 to 0.1 0.15+0.1 -0.05 0.2+0.1 -0.05 PG2214TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220C or higher Preheating time at 120 to 180C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) VPS Peak temperature (package surface temperature) Time at temperature of 200C or higher Preheating time at 120 to 150C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (pin temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260C or below : 10 seconds or less : 60 seconds or less : 12030 seconds : 3 times : 0.2%(Wt.) or below : 215C or below : 25 to 40 seconds : 30 to 60 seconds : 3 times : 0.2%(Wt.) or below : 260C or below : 10 seconds or less : 1 time : 0.2%(Wt.) or below : 350C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 WS260 VP215 Condition Symbol IR260 For soldering Preheating temperature (package surface temperature) : 120C or below Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10477EJ03V0DS 11 PG2214TB Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A. * The information in this document is current as of October, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4 - 0110 12 Data Sheet PG10477EJ03V0DS PG2214TB Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. * Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. * Do not lick the product or in any way allow it to enter the mouth. For further information, please contact NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) FAX: +852-3107-7309 TEL: +852-3107-7303 Hong Kong Head Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Taipei Branch Office FAX: +82-2-558-5209 TEL: +82-2-558-2120 Korea Branch Office NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 0406 |
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